Power chips are linked to outside circuits with packaging, and their performance depends upon the support of the packaging. In high-power situations, power chips are usually packaged as power modules. Chip interconnection describes the electrical connection on the upper surface area of the chip, which is normally light weight aluminum bonding cord in traditional modules. ^
Conventional power component package cross-section
Presently, commercial silicon carbide power modules still mostly make use of the packaging innovation of this wire-bonded conventional silicon IGBT module. They encounter troubles such as big high-frequency parasitic parameters, not enough heat dissipation capacity, low-temperature resistance, and insufficient insulation stamina, which restrict using silicon carbide semiconductors. The display screen of superb performance. In order to resolve these problems and fully exploit the big possible advantages of silicon carbide chips, lots of brand-new packaging technologies and remedies for silicon carbide power components have arised in the last few years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually developed from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold cords to copper cords, and the driving pressure is expense reduction; high-power devices have created from light weight aluminum cables (strips) to Cu Clips, and the driving pressure is to boost item performance. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared to typical bonding packaging approaches, Cu Clip technology has the complying with advantages:
1. The connection in between the chip and the pins is made of copper sheets, which, to a particular degree, changes the common wire bonding approach in between the chip and the pins. For that reason, a special bundle resistance worth, greater present flow, and better thermal conductivity can be gotten.
2. The lead pin welding location does not require to be silver-plated, which can totally save the cost of silver plating and poor silver plating.
3. The product look is totally regular with normal products and is mainly utilized in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power products, and various other fields.
Cu Clip has 2 bonding techniques.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding technique is much more costly and complicated, but it can attain better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cable bonding technique
The source pad makes use of a Clip technique, and the Gate utilizes a Cable technique. This bonding method is somewhat less expensive than the all-copper bonding method, saving wafer location (appropriate to really little entrance locations). The process is easier than the all-copper bonding approach and can obtain better Rdson and much better thermal impact.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper wire clip, please feel free to contact us and send an inquiry.
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